Question 1

[Anti-Redeposition] What is the technical basis for blocking secondary contamination and redeposition of removed particles?

Accepted Answer

AB NETWORKS adopts a "1:1 physical adsorption" method that individually targets and extracts particles, fundamentally blocking redeposition. Conventional methods such as roller cleaning, which involve surface-level contact, have an inherent structural limitation: contaminants accumulated on the roller surface can transfer back onto other clean areas of the wafer. In contrast, AB NETWORKS uses 0.2µm high-resolution vision to map the exact X-Y coordinates of contaminants, then precisely approaches each point with a Residue-free specialty gel to adsorb only the target particles. Since captured particles are completely isolated within the gel, the system provides a flawless mechanism in which transfer or redeposition to surrounding areas cannot occur.

Question 2

[Residue-Free Guarantee] Why are no organic residues left on the surface when using gel materials?

Accepted Answer

The proprietary specialty gel used by AB NETWORKS features Residue-free properties, perfectly preserving surface integrity after cleaning. When this gel meets target particles, it exerts strong adhesion to physically adsorb 99.9% of particles 0.7µm and larger. At the same time, it is engineered with strong cohesion so that the gel's own molecular structure does not detach or break during separation from the substrate. In other words, only contaminants are extracted while none of the gel's chemical or physical components are left on the wafer surface—delivering a complete Chemical-free environment that requires no additional rinsing or drying processes.

Question 3

What yield advantages does a Chemical-free dry process offer over Wet cleaning?

Accepted Answer

A fully Chemical-free dry process that excludes chemical substances completely blocks residual liquid film (watermarks) and surface reactions from chemicals (Chemical Contamination), ensuring long-term product reliability. Since the Rinse and Dry steps essential to WET cleaning are eliminated, the process flow is dramatically simplified, and degradation of light transmittance in sensors and LEDs as well as Optical Haze caused by solvent residue are fundamentally prevented. Furthermore, through physical non-destructive cleaning, the risks of chemical etching or deformation of fine patterns that can result from chemical processes are completely eliminated.

Question 4

How does the Dry Gel overcome and separate the strong physical adhesion of particles under 1µm?

Accepted Answer

The specialty gel's surface adhesion is engineered to be stronger than the electrostatic forces and van der Waals forces between particles and the substrate. Sub-micron particles, particularly those under 1µm, have almost no mass and therefore adhere to surfaces through powerful inter-particle attraction (Van der Waals Force) and Electrostatic Force rather than gravity. While the fluid shear force of compressed air (Air Blow) cannot break this bond, AB NETWORKS' dry gel stick directly contacts the target particle and applies physical adsorption energy far greater than its bond with the substrate, forcibly Extracting the particle from the surface.

Question 5

How has the Accessible Zone for cleaning been optimized compared to conventional methods?

Accepted Answer

AB NETWORKS' permanent needle gel method achieves ultra-fine control of the gel probe's diameter, narrowing the minimum cleanable distance to just 0.25mm from the substrate edge. This stands in contrast to conventional bulky Gel-Stick methods, which create Dead Zones of 0.75mm or more from the edge and result in limited cleaning coverage. As a result, the system can precisely target particles even in hard-to-reach Accessible Zones with fine step structures—such as HTCC Carriers or complex sensor modules—maximizing cleaning efficiency.

FAQ

[Anti-Redeposition] What is the technical basis for blocking secondary contamination and redeposition of removed particles?

[Residue-Free Guarantee] Why are no organic residues left on the surface when using gel materials?

What yield advantages does a Chemical-free dry process offer over Wet cleaning?

How does the Dry Gel overcome and separate the strong physical adhesion of particles under 1µm?

How has the Accessible Zone for cleaning been optimized compared to conventional methods?

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