top of page
FAQ
Automation Business
AB NETWORKS delivers non-destructive cleaning with zero physical damage through a dry gel extraction method based on real-time Pressure Tracking. The gel probe precisely controls the applied contact pressure at the gram level, physically adsorbing only the particles—removing 99.9% of particles 0.7µm and larger without the physical impact of ultrasonic cleaning or the thermal shock of laser cleaning.
AB NETWORKS detects particles using a 2D AOI system with 0.2µm resolution and guarantees a removal rate of over 99.9% for particles 0.7µm and larger. By combining ultra-precision vision technology with diffuse illumination, the system accurately maps the X-Y coordinates of fine particles even on curved surfaces and complex topographies. Z-axis indexing technology determines in advance whether each particle can be removed, enhancing cleaning reliability.
AB NETWORKS adopts a "1:1 physical adsorption" method that individually targets and extracts particles, fundamentally blocking redeposition. Unlike Air Blow methods that rely on fluid flow or roller cleaning methods that involve surface-level contact, our dry gel approach selectively transfers only the contaminants—controlling the probability of captured particles migrating to nearby clean areas down to 0%.
The proprietary specialty gel used by AB NETWORKS features Residue-free properties, perfectly preserving surface integrity after cleaning. While its adhesion force to particles is engineered to be stronger than electrostatic force, the gel is optimized to prevent any chemical or physical detachment from itself when separating from the substrate—delivering a Chemical-free process with no need for additional cleaning or concerns about residues.
AB NETWORKS supports high-speed in-line processing of up to 3,000+ pcs/h, enabling immediate integration into high-volume mass production processes. The MV-WA3.3, our mass-production model, delivers high productivity of over 3,000 units per hour. Its in-line design allows direct installation into existing production lines, performing real-time continuous cleaning without creating bottlenecks in process flow.
AB NETWORKS' Dispensed Gel method dramatically reduces maintenance costs through minimized consumption and reuse of more than 10 times. With a lower unit cost per consumable than conventional Gel-Stick methods, and the efficiency to handle a total of 310 points with just 31 gel sets, it directly contributes to reducing process costs in long-term operations.
AB NETWORKS automatically generates a Particle Distribution Map before and after cleaning, providing complete traceability of process history. A real-time monitoring dashboard for metrics such as Overall Equipment Effectiveness (OEE), production time, and operating rate enables engineers to scientifically analyze defect patterns and optimize process conditions.
AB NETWORKS meets stringent cleanroom standards from Class 100 to Class 10,000 and is equipped with internal cleanliness maintenance functions. The design prevents particle dispersion inside the equipment, tailored for high-precision optical component manufacturing environments. A secondary contamination prevention mechanism preserves an exceptionally clean environment even during equipment operation.
AB NETWORKS systems handle a wide range of wafer sizes from 6-inch to 12-inch, along with various substrate formats including Bare, Frame, and Glass—all on a single piece of equipment. Our equipment lineup (MV-CA-W2.0, MV-CWA1.3A, etc.) is optimized for diverse industries and form factors, covering applications from dedicated semiconductor wafer cleaning to Micro LED and automotive sensor packaging processes.
AB NETWORKS uses an intelligent gel management system that detects pressure changes in the probe and notifies engineers of the optimal replacement timing. By managing the gel's reuse count (up to 10 times) and actual adsorption performance through data-driven monitoring, the system prevents waste of consumables while consistently maintaining the highest cleaning quality.
bottom of page
